SPT-3G: detectors from Stage-3 to Stage-4 ‣
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Produc1on throughput is high. 2-3 weeks for a 5 wafer batch (batch size rather arbitrary). Interleaved fabrica1on yields 5 arrays every 1-2 weeks. Fabrica1on throughput comparable to tes1ng 1me. •
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Three-band mul1chroic TES pixels (sinuous antenna design). Arrays on 150 mm wafers. 10 wafers delivered to SPT for the full SPT-3G focal plane.
Array characteriza1on limited by systema1c uncertain1es (e.g. NDF calibra1on) and sta1s1cs (need to measure a sufficiently large number of detectors).
Primary varia1on in detector performance arises from film proper1es, not detector architecture. •
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For S4 scale fabrica1on, need to develop an empirical model connec1ng film proper1es to cryogenic performance. Characteriza1on needs to be at relevant sta1s1cal and systema1c power. Need to develop techniques for evalua1ng, monitoring and controlling thin film proper1es without requiring full array cryo tes1ng for feedback. C.L. Chang, CMB-S4 mee1ng at SLAC, Feb 28-Mar 1, 2017 1
